2-3 april 2025 | Prioritet Serneke Arena | Göteborg

Solutionator AB

Ultra Low Profile Interposers

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Ultra low profile, high density one piece arrays with compression contacts.
Samtec’s Z-Ray™ micro array interposers are ultra low profile, high density, and highly customizable solutions ideal for Board-to-Board, IC-to-Board, and Cable-to-Board applications.
1 mm standard body height
• Dual compression contacts
• Single compression with solder ball
• Performance up to 20 GHz / 40 Gbps
• 0,80 mm or 1,00 mm pitch standard
• Highly customizable system

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